GAIN THE DIAMOND ADVANTAGE

• Leading supplier of rugged embedded boards and systems for fixed and mobile applications
• The leader in analog I/O on single board computers and I/O modules
• Wide-temperature, rugged products
• 20+ years of product excellence and lifecycle management
• Extensive customization services including custom COM baseboards
• Broad family of legacy PC/104 I/O
• The originator of FeaturePak I/O
  

We're committed to small form-factor open standards...

WHAT'S NEW?

Diamond Debuts World's First FeaturePak Modules!

COM Express form-factor Embedded-Ready Subsystem with triple-play expansion

Wide-temp COM Express Modules powered by Atom and Core 2 Duo LV CPUs

Recent Announcements

• FeaturePak Module Boasts 96 Programmable Digital I/O Lines
• FeaturePak Embedded I/O Comes to SUMIT-ISM Stacks
• Compact Boardset Merges COM Express With Triple-Play I/O