Products Overview


Processor Modules


I/O Expansion Modules


Ruggedized Systems


Enclosures & Accessories


Software


Custom Products

Services Overview


Customization


Ruggedization


System Integration


COM Baseboard Designs


Software

Support Overview


Technical Resources


Browse DSC Support CD


Discussion Forum


Frequently Asked Questions


Contact Technical Support


Request an RMA

About Diamond Systems


The Diamond Advantage


Markets & Applications


News & Announcements


Events


Career Opportunities

Contact Diamond Systems


Contact Sales


Career Opportunities

  Diamond Systems Corporation
you are not logged in:
login | signup
lost password?

Fastening Controller Utilizes Customized Digital I/O Module

Application Overview

Assembly line automation tools have to be versitile and easy to use. In the past, one of the inherent drawbacks of similar fastening controllers has been the user interface, which tended to be unnecessarily complex and difficult to use. This assembly line automation tools manufacturer addressed this with their controller, which offers a simple user interface and improved speed with the potential for fewer errors.

While developing the controller, Diamond Systems was approached because of it's vast computing expertise with high reliability, small formfactor platforms.

Customer's Requirements

The physical requirement for this device called for a small, PC/104 sized module with 16 digital I/O lines (with bi-polar polarity) that was rugged enough to perform well in a high temperature environment.

Diamond's Customization Program

Diamond Systems had been providing this manufacturer with thousands of its Opal PC/104 modules for use in their fastening controllers for over 10 years. This project called for some customization on the standard product. Diamond's modified the verion of the Opal board that they had been using to include bi-polar digital I/O. This is just yet another example of how Diamond Systems’ extended services program can benefit customer’s broad spectrum of application challenges.



Click here to return to the main article list.