Level 2 Integration: System Level Assemblies

System Level integration begins with development of a requirements document that defines the system in detail. Diamond's integration team forms a baseline solution using off-the-shelf products from Diamond Systems as well as our third party partners. We then take into consideration any design needs for ruggedization or customization of these standard board-level products. We validate the core hardware to ensure compatibility and performance. The hardware core is assembled and functionally tested using our standard acceptance tests or customer-supplied software. This level incorporates all the features of Level 1 plus installation of customer-supplied software, assembly into an enclosure, and testing of the complete system.

Level 2 Example

Industrial: Traffic Control A large European supplier of traffic control systems was awarded a contract to install variable speed limit signs in the vicinity of schools in response to recently-passed legislation. Due to the need to have the signs operational by the start of the school year only two months away, the customer was on a very tight schedule. Diamond Systems was able to provide a complete system based on a low-cost third-party CPU board and our own I/O boards, all packaged inside our Pandora enclosure. A custom front panel and CPU I/O connector board were designed to eliminate cables and improve ruggedness. Integration Quicklinks Level 1: Hardware Core Sub-Assemblies Level 2: System Level Assemblies Level 3: OEM Ready Solutions

System Components: Morpheus G300 fanless CPU board Custom panel I/O board Emerald-MM RS-232/485 serial port board Onyx-MM digital I/O board Jupiter-MM DC/DC power supply Hitachi ruggedized notebook hard drive CompactFlash adapter board Pandora system enclosure (customized)